Thijs Kniknie

Risky move to a more flexible and productive die bonding equipment results in successful ramp-up at Nexperia


In this presentation Thijs Kniknie shares his experience with the integration and release of an existing bonding technology on Nexperia ITEC’s latest die bonding platform ADAT3-XF. This development has resulted in higher flexibility and a significant improvement in changeover times in the production process.

Nexperia is a dedicated semiconductor company with leadership positions in its product areas (discrete, logic and MOSFETs). ITEC is the department within Nexperia that develops manufacturing equipment for these small components. For that purpose, it has developed the most flexible die bonder in the world, the ADAT3-XF.

Developing die bonders for small components is highly demanding. Nexperia produces over 90 billion units per year and market demands are growing strongly in numbers and flexibility. Nexperia expects to grow at a yearly 15 percent. Together with market demands, this asks for an increase in flexibility of the production capacity.

One of the most important production processes in the Nexperia factories is the so-called eutectic die bonding process that uses alloys to achieve very nicely controllable melting/solidifying behavior. The advantage of this process is very low production costs. A disadvantage of the production lines currently used is limited flexibility. A changeover to another product is often done with a completely new production line meaning large investments in production capacity.

Medio 2018 the market growth showed the need for increased production capacity in eutectic die bonding in the Nexperia factories, this to ensure the committed product deliveries in 2019. This led to the decision to integrate the eutectic die bonding process on the new die bonding platform ADAT3-XF.

This resulted in a new platform that decreased changeover times by a factor of 4. Changing from one tot the other die bonding process can now typically be done against about 25 percent of the cost of a traditional changeover. The most flexible die bonder in the world ADAT3-XF will now guarantee the required increase on production capacity in 2019. This is both on time and first time right!


Thijs has a background in dynamics and control and more than 10 years of experience in precision equipment design.

Graduated from Eindhoven University of Technology in 2018, he started his career through TMC at startup MuTracx, an Océ spinoff in industrial inkjet printing for PCB inner layer production. First responsible for dynamics modeling and control design, developing later into mechatronic design, integration and system engineer.

In 2012 he joined Philips Innovation Services to work as a mechatronics design engineer on ASML’s 450mm platforms, both in immersion and vacuum applications. As these projects discontinued, the opportunity to work at NXP came by in 2013. At the Industrial Technology and Engineering Center (ITEC) department, he took up the role of principal mechatronics engineer and team leader mechatronics and moved gradually to platform architect for the ADAT3-XF die bond and die sort platform.

The Standard Products division diverged from NXP in 2017 and continued as Nexperia, taking ITEC along with its journey. With a renewed focus on high-volume discretes, logic and MOSFETs production, Thijs’ focus now is on developing the ADAT3-XF platform as the flexible one-stop-shop for backend semiconductor assembly at the highest quality and lowest cost of ownership.